Patent Assignment
Reel/Frame 018679/0230
Assignment of Assignor's Interest
Recorded: 2006-12-14
Received: 2006-12-19
Pages: 2
Assignor
AKITA ELECTRONICS SYSTEMS CO., LTD.
Executed: 2006-10-01
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JPX, JAPAN
Covered Properties
(6)
Semiconductor Device and a Method of Manufacturing the Same
Application:
11/392,689 →
Semiconductor device
Application:
11/340,562 →
A Semiconductor Device Including a Semiconductor Chip Formed on an Insulating Element Such as a Tape, and Including an Improved Insulating Arrangement
Application:
10/921,961 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
10/743,882 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
10/194,224 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
09/769,359 →