Assignment of Assignor's Interest

Recorded: 2006-12-22 Pages: 6

Assignors

PARK, JAE-HYUN

Executed: 2006-10-23

OH, JAE-HEE

Executed: 2006-10-23

LEE, SE-HO

Executed: 2006-11-22

JEONG, WON-CHEOL

Executed: 2006-10-23

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG, YEONGTON-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Methods of Forming Fine Patterns, and Methods of Forming Trench Isolation Layers Using the Same

Patent: 7,534,723 →

Application: 11/519,081 →

Publication: US 2007/0059934

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.