Patent Assignment
Reel/Frame 018687/0702
Assignment of Assignor's Interest
Recorded: 2006-12-28
Pages: 3
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING INC.
26, CHIN 3RD RD., 811, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Method for Encasulating Sensor Chips