Patent Assignment
Reel/Frame 018690/0235
Assignment of Assignor's Interest
Recorded: 2006-12-28
Pages: 4
Assignors
MORITA, ETSUROU
Executed: 2006-12-11
OKAWA, SHINJI
Executed: 2006-12-11
ONO, ISOROKU
Executed: 2006-12-07
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Direct Bonded Soi Wafer and Direct Bonded Soi Wafer Manufactured by the Method