Patent Assignment
Reel/Frame 018698/0553
Assignment of Assignor's Interest
Recorded: 2007-01-02
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2006-11-20
CHEN, HAI-CHING
Executed: 2006-11-20
BAO, TIEN-I
Executed: 2006-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Schemes for Forming Barrier Layers for Copper in Interconnect Structures