Patent Assignment
Reel/Frame 018699/0314
Assignment of Assignor's Interest
Recorded: 2007-01-02
Pages: 3
Assignor
JANG, HYUNG-SOON
Executed: 2007-01-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Wiring of Semiconductor Device and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.