Patent Assignment
Reel/Frame 018705/0334
Assignment of Assignor's Interest
Recorded: 2006-12-19
Pages: 3
Assignor
MASUDA, TAKATOSHI
Executed: 2006-12-11
Assignee
DISCO CORPORATION
13-11 OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method for Wafer and Processing Apparatus Therefor