IP Library › Assignment 018715/0468
Patent Assignment
Reel/Frame 018715/0468

Assignment of Assignor's Interest

Recorded: 2007-01-05 Pages: 2
Assignors
IMAMURA, HIROYUKI
Executed: 2006-08-10
KOUTANI, NOBUYUKI
Executed: 2006-08-10
NAKAMURA, YOSHIFUMI
Executed: 2006-08-10
TOKUSHIMA, KENSHI
Executed: 2006-08-10
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Circuit Board with Auxiliary Wiring Configuration to Suppress Breakage During Bonding Process.
Patent: 7,439,611 →
Application: 11/534,288 →
Publication: US 2007/0075439
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 18, 2020
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 052184/0943 →
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →