Patent Assignment
Reel/Frame 018715/0909
Assignment of Assignor's Interest
Recorded: 2006-12-14
Received: 2006-12-21
Pages: 2
Assignor
SODA, EIICHI
Executed: 2006-12-05
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Property
(1)
Method of Patterning Multiple-Layered Resist Film and Method of Manufacturing Semiconductor Device
Application:
11/638,499 →