Patent Assignment
Reel/Frame 018719/0438
Assignment of Assignor's Interest
Recorded: 2007-01-08
Pages: 3
Assignor
WANG, CHIEN-HAO
Executed: 2006-11-30
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Thermally Enhanced Coreless Thin Substrate with Embedded Chip and Method for Manufacturing the Same