Patent Assignment
Reel/Frame 018727/0915
Assignment of Assignor's Interest
Recorded: 2006-12-21
Pages: 3
Assignors
ITO, SOTARO
Executed: 2006-10-24
TAKAHASHI, MICHIMASA
Executed: 2006-10-24
MIKADO, YUKINOBU
Executed: 2006-10-24
Assignee
IBIDEN CO., LTD.
1, KANDO-CHO, 2-CHOME, OGAKI-SHI, GIFU 503-8604, JAPAN
Covered Property
(1)
Multilayered Printed Circuit Board and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.