Patent Assignment
Reel/Frame 018751/0261
Assignment of Assignor's Interest
Recorded: 2006-12-28
Pages: 3
Assignor
HIROSE, MASAYUKI
Executed: 2006-09-18
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 541-0041, JAPAN
Covered Property
(1)
Chip Package and Method for Fabricating the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 19, 2009
From: CHOU, CHIEN-KANG; CHOU, CHIU-MING; LIN, LI-REN; LO, HSIN-JUNG
To: MEGICA CORPORATION
Reel/Frame 022417/0849 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →