IP Library Assignment 018751/0261
Patent Assignment
Reel/Frame 018751/0261

Assignment of Assignor's Interest

Recorded: 2006-12-28 Pages: 3
Assignor
HIROSE, MASAYUKI
Executed: 2006-09-18
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 541-0041, JAPAN
Covered Property (1)
Chip Package and Method for Fabricating the Same
Patent: 8,836,146 →
Application: 11/681,219 →
Publication: US 2007/0205520
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 19, 2009
From: CHOU, CHIEN-KANG; CHOU, CHIU-MING; LIN, LI-REN; LO, HSIN-JUNG
To: MEGICA CORPORATION
Reel/Frame 022417/0849 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →