Patent Assignment
Reel/Frame 018762/0241
Assignment of Assignor's Interest
Recorded: 2006-12-29
Pages: 3
Assignor
HAN, KWON WHAN
Executed: 2006-12-20
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Through-Silicon via and Method for Forming the Same