Patent Assignment
Reel/Frame 018765/0408
Assignment of Assignor's Interest
Recorded: 2007-01-03
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor device having a heatsink plate with bored portions
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.