Assignment of Assignor's Interest

Recorded: 2007-01-05 Pages: 3

Assignors

TOKUMITSU, AKIRA

Executed: 2006-11-10

OOKA, FUMIHIKO

Executed: 2006-11-10

KAWANO, HIROSHI

Executed: 2006-11-10

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor Chip Package and Fabrication Method Thereof

Patent: 7,489,043 →

Application: 11/582,565 →

Publication: US 2007/0090540

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.