IP Library › Assignment 018782/0637
Patent Assignment
Reel/Frame 018782/0637

Assignment of Assignor's Interest

Recorded: 2007-01-10 Pages: 2
Assignors
LEE, SEON GOO
Executed: 2006-12-22
HAN, KYUNG TAEG
Executed: 2006-12-21
HAN, SEONG YEON
Executed: 2006-12-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON-SI, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Chip Coated Light Emitting Diode Package and Manufacturing Method Thereof
Patent: 7,714,342 →
Application: 11/651,524 →
Publication: US 2007/0158669
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →