IP Library › Assignment 018809/0300
Patent Assignment
Reel/Frame 018809/0300

Assignment of Assignor's Interest

Recorded: 2007-01-17 Pages: 2
Assignors
KOYATA, SAKAE
Executed: 2006-11-01
HASHII, TOMOHIRO
Executed: 2006-11-01
MURAYAMA, KATSUHIKO
Executed: 2006-11-01
TAKAISHI, KAZUSHIGE
Executed: 2006-11-01
KATOH, TAKEO
Executed: 2006-11-01
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, 2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method for Manufacturing Silicon Wafers
Patent: 7,601,644 →
Application: 11/597,169 →
Publication: US 2007/0224821
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct a Document Previously Recorded at Reel 018809, Frame 0300. (Assignment of Assignor's Interest) Dec 12, 2007
From: KOYATA, SAKAE; HASHII, TOMOHIRO; MURAYAMA, KATSUHIKO; TAKAISHI, KAZUSHIGE
To: SUMCO CORPORATION
Reel/Frame 020260/0940 →