Patent Assignment
Reel/Frame 018818/0651
Assignment of Assignor's Interest
Recorded: 2007-01-29
Pages: 6
Assignors
WANG, CHUEN KHIANG
Executed: 2007-01-08
TAN, HIEN BOON
Executed: 2006-11-17
TEO, KOON HWEE JOANNE
Executed: 2007-01-15
SONG, SIN NEE
Executed: 2006-11-02
LUA, KOON TIAN EDMUND
Executed: 2006-12-12
Assignee
UNITED TEST AND ASSEMBLY CENTER LIMITED
5 SERANGOON NORTH AVENUE 5, SINGAPORE, 554916, SINGAPORE
Covered Property
(1)
Multiple stacked die window csp package and method of manufacture
Application:
10/598,514 →
Publication:
US 2007/0132081
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement
Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Release of Security Interest
Jan 5, 2018
From: JPMORGAN CHASE BANK, N.A.
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 044549/0152 →