IP Library › Assignment 044549/0152
Patent Assignment
Reel/Frame 044549/0152

Release of Security Interest

Recorded: 2018-01-05 Pages: 7
Assignor
JPMORGAN CHASE BANK, N.A.
Executed: 2013-02-07
Assignee
UNITED TEST AND ASSEMBLY CENTER LTD.
5 SERANGOON NORTH AVENUE 5, ANG MO KIO DISTRICT, 554916, SINGAPORE
Covered Properties (10)
Molded High Density Electronic Packaging Structure for High Performance Applications
Patent: 7,361,995 →
Application: 10/543,301 →
Publication: US 2006/0087033
Multi-Chip Ball Grid Array Package and Method of Manufacture
Patent: 7,851,899 →
Application: 10/552,046 →
Publication: US 2007/0158815
Multiple stacked die window csp package and method of manufacture
Application: 10/598,514 →
Publication: US 2007/0132081
High Density Chip Scale Leadframe Package and Method of Manufacturing the Package
Patent: 8,129,222 →
Application: 10/721,382 →
Publication: US 2004/0104457
Integrated Circuit Package with Leadframe Enhancement and Method of Manufacturing the Same
Patent: 7,109,570 →
Application: 10/812,058 →
Publication: US 2005/0051876
High Density Chip Scale Leadframe Package and Method of Manufacturing the Package
Patent: 7,345,357 →
Application: 11/205,182 →
Publication: US 2005/0275077
Semiconductor Chip Package and Method of Manufacture
Patent: 7,678,610 →
Application: 11/260,091 →
Publication: US 2006/0192292
High Performance Chip Scale Leadframe Package with Thermal Dissipating Structure and Annular Element and Method of Manufacturing Package
Patent: 7,323,769 →
Application: 11/429,248 →
Publication: US 2006/0202313
Thermally Enhanced Semiconductor Package and Method of Producing the Same
Patent: 8,039,951 →
Application: 11/495,781 →
Publication: US 2007/0164425
Cavity Chip Package
Patent: 7,339,278 →
Application: 11/536,635 →
Publication: US 2007/0069371
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 26, 2003
From: TAN, HIEN BOON; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Reel/Frame 014744/0665 →
Assignment of Assignor's Interest Mar 30, 2004
From: MANALAC, RODEL; TAN, HIEN BOON; POH, FRANCIS; SIAT, JAIME
To: UNITED TEST AND ASSEMBLY TEST CENTER, LTD.
Reel/Frame 015158/0691 →
Assignment of Assignor's Interest Jul 26, 2005
From: GOH, KIM YONG; KAPOOR, RAHUL; SUN, ANTHONY YI-SHENG; CHONG, DESMOND YOK RUE
To: UNITED TEST AND ASSEMBLY CENTER LTD.; XILINX, INC.
Reel/Frame 017413/0842 →
Assignment of Assignor's Interest May 10, 2006
From: WANG, CHUEN KHIANG; TAN, HIEN BOON; SUN, ANTHONY YI SHENG; SONG, SIN NEE
To: UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Reel/Frame 018198/0103 →
Assignment of Assignor's Interest Jul 31, 2006
From: KOLAN, RAVI KANTH; RETUTA, DANNY VALLEJO; TAN, HIEN BOON; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 018147/0071 →
Corrective Assignment to Correct the 6TH Assignor's Name, Previously Recorded at Reel/Frame 018147/0071 Sep 22, 2006
From: KOLAN, RAVI KANTH; RETUTA, DANNY VALLEJO; TAN, HEIN BOON; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 018300/0221 →
Assignment of Assignor's Interest Sep 29, 2006
From: IKSAN, HENRY, MR.; KIM, SEONG KWANG BRANDON, MR.; TANARY, SUSANTO, MR.; TAN, HIEN BOON, MR.
To: UNITED TEST AND ASSEMBLY CENTER LTD
Reel/Frame 018322/0912 →
Assignment of Assignor's Interest Jan 29, 2007
From: WANG, CHUEN KHIANG; TAN, HIEN BOON; TEO, KOON HWEE JOANNE; SONG, SIN NEE
To: UNITED TEST AND ASSEMBLY CENTER LIMITED
Reel/Frame 018818/0651 →
Assignment of Assignor's Interest Jan 30, 2007
From: CHEN, FUNG LENG; KIM, SEONG KWANG BRANDON; CHA, WEE LIM; SUN, YI-SHENG ANTHONY
To: UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD.; INFINEON TECHNOLOGIES
Reel/Frame 018854/0010 →
Security Agreement Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Assignment of Assignor's Interest Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment. Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment. Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →
Assignment of Assignor's Interest Jan 15, 2018
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 044624/0017 →