Patent Assignment
Reel/Frame 015158/0691
Assignment of Assignor's Interest
Recorded: 2004-03-30
Pages: 2
Assignors
MANALAC, RODEL
Executed: 2004-02-19
TAN, HIEN BOON
Executed: 2004-02-19
POH, FRANCIS
Executed: 2004-02-19
SIAT, JAIME
Executed: 2004-02-19
CORDERO, ROLAND
Executed: 2004-02-19
Assignee
UNITED TEST AND ASSEMBLY TEST CENTER, LTD.
5 SERANGOON NORTH AVENUE 5, 554916, SINGAPORE
Covered Properties
(2)
Integrated Circuit Package with Leadframe Enhancement and Method of Manufacturing the Same
Lead frame enhancement and method of producing a semiconductor package
Application:
60/500,696 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement
Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Assignment of Assignor's Interest
Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →
Release of Security Interest
Jan 5, 2018
From: JPMORGAN CHASE BANK, N.A.
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 044549/0152 →