IP Library › Patent Application 60500696
Patent Application Provisional
App. No. 60/500,696 · Confirmation No. 7683

Lead frame enhancement and method of producing a semiconductor package

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2003-09-08 TRNA Transmittal of New Application 1 View
2003-09-08 SPEC Specification 7 View
2003-09-08 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/500,696
Filed
2003-09-08