Patent Assignment
Reel/Frame 037959/0822
Assignment of Assignor's Interest
Recorded: 2016-03-01
Pages: 6
Assignor
UNITED TEST AND ASSEMBLY CENTER LIMITED
Executed: 2015-05-08
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Properties
(46)
Packaging of a Microchip Device
Multiple Chip Semiconductor Packages
Multiple Die Stack Package
Packaged Device with Thermal Enhancement and Method of Packaging
Molded High Density Electronic Packaging Structure for High Performance Applications
High Density Chip Scale Leadframe Package and Method of Manufacturing the Package
Integrated Circuit Package with Leadframe Enhancement and Method of Manufacturing the Same
Semiconductor Chip Package and Method of Manufacture
Leadframe Enhancement and Method of Producing a Multi-Row Semiconductor Package
Thermally Enhanced Semiconductor Package and Method of Producing the Same
Cavity Chip Package
Structurally-Enhanced Integrated Circuit Package and Method of Manufacture
Multi-Die Ic Package and Manufacturing Method
Method of Producing a Semiconductor Package
Stacked Die Packages
Inverted Lead Frame in Substrate
Semiconductor Package with Under Bump Metallization Aligned with Open Vias
Method of Assembling a Silicon Stack Semiconductor Package
Stacked Die Semiconductor Package and Method of Assembly
Mold Design and Semiconductor Package
Through Silicon via Dies and Packages
Vented Die and Package
Semiconductor Package and Method of Making the Same
Copper on Organic Solderability Preservative (Osp) Interconnect and Enhanced Wire Bonding Process
Packaging Structural Member
Interposer for Semiconductor Package
Semiconductor Package and Method of Packaging Semiconductor Devices
Subscriber Identity Module (Sim) Card
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Mold Design and Semiconductor Package
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Interposer for Semiconductor Package
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Leadframe Area Array Packaging Technology
Packaging Structural Member
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods for Forming Semiconductor Package
Through Silicon via Dies and Packages
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Leadframe Area Array Packaging Technology
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 14, 2003
From: KHIANG, WANG CHUEN
To: UNITED TEST & ASSEMBLY CENTER LIMITED
Reel/Frame 013853/0455 →
Assignment of Assignor's Interest
Mar 21, 2003
From: KHIANG, WANG CHUEN
To: UNITED TEST & ASSEMBLY CENTER LIMITED
Reel/Frame 013874/0469 →
Assignment of Assignor's Interest
Jun 6, 2003
From: KHIANG, WANG CHUEN; CHUAN, KOH YONG; CHIN, FONG KOK
To: UNITED TEST & ASSEMBLY CENTER LIMITED
Reel/Frame 014147/0833 →
Assignment of Assignor's Interest
Jun 30, 2003
From: BOON, TAN HIEN; HAO, LIU; GIL, PARK SOO
To: UNITED TEST & ASSEMBLY CENTER LTD.
Reel/Frame 014222/0716 →
Assignment of Assignor's Interest
Nov 26, 2003
From: TAN, HIEN BOON; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Reel/Frame 014744/0665 →
Assignment of Assignor's Interest
Mar 30, 2004
From: MANALAC, RODEL; TAN, HIEN BOON; POH, FRANCIS; SIAT, JAIME
To: UNITED TEST AND ASSEMBLY TEST CENTER, LTD.
Reel/Frame 015158/0691 →
Assignment of Assignor's Interest
Jul 26, 2005
From: GOH, KIM YONG; KAPOOR, RAHUL; SUN, ANTHONY YI-SHENG; CHONG, DESMOND YOK RUE
To: UNITED TEST AND ASSEMBLY CENTER LTD.; XILINX, INC.
Reel/Frame 017413/0842 →
Assignment of Assignor's Interest
May 10, 2006
From: WANG, CHUEN KHIANG; TAN, HIEN BOON; SUN, ANTHONY YI SHENG; SONG, SIN NEE
To: UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Reel/Frame 018198/0103 →
Assignment of Assignor's Interest
Jul 17, 2006
From: RETUTA, DANNY VALLEJO; TAN, HIEN BOON; TANARY, SUSANTO; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Reel/Frame 018066/0686 →
Assignment of Assignor's Interest
Jul 31, 2006
From: KOLAN, RAVI KANTH; RETUTA, DANNY VALLEJO; TAN, HIEN BOON; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 018147/0071 →
Corrective Assignment to Correct the 6TH Assignor's Name, Previously Recorded at Reel/Frame 018147/0071
Sep 22, 2006
From: KOLAN, RAVI KANTH; RETUTA, DANNY VALLEJO; TAN, HEIN BOON; SUN, ANTHONY YI SHENG
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 018300/0221 →
Assignment of Assignor's Interest
Sep 29, 2006
From: IKSAN, HENRY, MR.; KIM, SEONG KWANG BRANDON, MR.; TANARY, SUSANTO, MR.; TAN, HIEN BOON, MR.
To: UNITED TEST AND ASSEMBLY CENTER LTD
Reel/Frame 018322/0912 →
Security Agreement
Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Assignment of Assignor's Interest
Nov 13, 2007
From: MEHTA, GAURAV; TAN, HIEN BOON; TANARY, SUSANTO; CHEONG, MARY ANNIE
To: UNITED TEST AND ASSEMBLY CENTER, LTD.
Reel/Frame 020102/0633 →
Assignment of Assignor's Interest
Nov 14, 2007
From: RETUTA, DANNY; TAN, HIEN BOON; SUN, ANTHONY YI SHENG; CHEONG, MARY ANNIE
To: UNITED TEST AND ASSEMBLY CENTER, LTD.
Reel/Frame 020110/0790 →
Assignment of Assignor's Interest
Mar 4, 2008
From: KUAH, HSIAN PANG; PHUA, JENNY
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 020592/0601 →
Corrective Assignment to Correct the Correct Serial Number Previously Recorded on Reel 020592 Frame 0601. Assignor(S) Hereby Confirms the 11/959,519.
Mar 5, 2008
From: KUAH, HSIAN PANG; PHUA, JENNY
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 020601/0235 →
Security Agreement
Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Assignment of Assignor's Interest
Aug 7, 2008
From: ROBLES, ROEL; RETUTA, DANNY; CHEONG, MARY ANNIE; TAN, HIEN BOON
To: UNITED TEST AND ASSEMBLY CENTER. LTD.
Reel/Frame 021352/0571 →
Assignment of Assignor's Interest
Aug 7, 2008
From: HAO, LIU; KOLAN, RAVI KANTH
To: UNITED TEST AND ASSEMBLY CENTER. LTD.
Reel/Frame 021352/0597 →
Assignment of Assignor's Interest
Nov 11, 2008
From: KOLAN, RAVI KANTH; TAN, HIEN BOON; SUN, ANTHONY YI SHENG; SIVALINGAM, KRISHNAMURTHY
To: UNITED TEST AND ASSEMBLY CENTER, LTD
Reel/Frame 021813/0260 →
Corrective Assignment to Correct the Fourth Inventor's First Name Should Be Krishnamoorthi Previously Recorded on Reel 021813 Frame 0260. Assignor(S) Hereby Confirms the Assignment.
Apr 21, 2009
From: KOLAN, RAVI KANTH; TAN, HIEN BOON; SUN, ANTHONY YI SHENG; SIVALINGAM, KRISHNAMOORTHI
To: UNITED TEST AND ASSEMBLY CENTER, LTD
Reel/Frame 022576/0845 →
Corrective Assignment to Correct the Sixth Inventor's Last Name Should Be Wang. Document Previously Recorded on Reel 020102 Frame 0533. Assignor(S) Hereby Confirms the Assignment.
Apr 24, 2009
From: MEHTA, GAURAV; TAN, HIEN BOON; TANARY, SUSANTO; CHEONG, MARY ANNIE
To: UNITED TEST AND ASSEMBLY CENTER, LTD
Reel/Frame 022665/0731 →
Assignment of Assignor's Interest
Sep 3, 2010
From: WANG, CHUEN KHIANG; LIU, HAO; TAN, HIEN BOON; LAW, CLIFTON TIEK LYK
To: UNITED TEST AND ASSEMBLY CENTER LIMITED
Reel/Frame 024941/0942 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →