Semiconductor packages and methods of packaging semiconductor devices

1. A method of forming semiconductor assemblies, the method comprising:

providing an interposer substrate prepared with a plurality of interposers with through interposer vias, the interposer substrate comprises a first surface and a second surface, wherein

the through interposer vias extend from the first surface to the second surface of the interposer substrate,

the first and second surfaces of the interposer substrate comprise interposer contact pads thereon, the through interposer vias facilitate electrical coupling between the interposer contact pads on the first and second surfaces of the interposer substrate, and

the second surface of the interposer substrate comprises interposer contacts disposed thereon, the interposer contacts are configured to facilitate coupling between the interposer contact pads and an external device;

mounting a plurality of first dies to first die attach regions on the first surface of the interposer substrate, the first die comprises a first surface with first conductive contacts thereon, wherein the interposer substrate comprises material with coefficient of thermal expansion (CTE) similar to that of the first die, the first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer substrate; and

singulating the interposer substrate with mounted first dies into individual semiconductor assemblies.

2. The method in claim 1 comprises performing a reflow process to form connections between the first dies and interposer substrate.

3. The method in claim 2 comprises dispensing an underfill into a space between the first dies and the first surface of the interposer substrate.

4. The method in claim 1 comprises mounting a plurality of second dies to second die attach regions on the first surface of the interposer substrate, the second die attach region is disposed on a periphery of the first die attach region.

5. The method in claim 4 comprises performing a reflow process to form connections between the first and second dies and interposer substrate.

6. The method in claim 4 comprises dispensing an underfill into a space between the first and second dies and the first surface of the interposer substrate.

7. The method in claim 1 comprises forming an encapsulant on the interposer substrate, wherein the encapsulant encapsulates the first dies.

8. A method of forming semiconductor assemblies, the method comprising:

providing a package base prepared with a plurality of package substrates, the package base comprises first and second surfaces, wherein the first surface of the package base comprises first substrate contact pads while the second surface of the package base comprises external substrate contacts;

mounting a plurality of interposers with through interposer vias on the first surface of the package base, wherein each of the interposers comprises

a first surface and a second surface, wherein the first and second surfaces of the interposer comprise interposer contact pads thereon,

the through interposer vias facilitate electrical coupling between the interposer contact pads on the first and second surfaces of the interposer, wherein the through interposer vias extend from the first surface to the second surface of the interposer, and

the second surface of the interposer comprises interposer contacts disposed thereon, the interposer contacts are configured to facilitate electrical coupling between the interposer contact pads and the package substrate;

mounting a plurality of first dies to first die attach regions on the first surface of the interposers, the first die comprises a first surface with first conductive contacts thereon, wherein the interposer comprises material with CTE similar to that of the first die, the first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer; and

singulating the package base with mounted first dies and interposers into individual semiconductor assemblies.

9. The method in claim 8 comprises performing a reflow process to form connections between the first dies and interposers.

10. The method in claim 9 comprises dispensing an underfill into a space between the first die and the first surface of the interposer.

11. The method in claim 8 comprises mounting a plurality of second dies to second die attach regions on the first surface of the interposers, the second die attach region is disposed on a periphery of the first die attach region.

12. The method in claim 11 comprising:

dispensing an underfill in a space between the first and second dies and the first surface of the interposer; and

dispensing an underfill in a space between the interposer and package substrate.

13. A semiconductor assembly comprising:

an interposer with through interposer vias, the interposer comprises a first surface and a second surface, wherein

the through interposer vias extend from the first surface to the second surface of the interposer,

the first and second surfaces of the interposer comprise interposer contact pads thereon, the through interposer vias facilitate electrical coupling between the interposer contact pads on the first and second surfaces of the interposer, and

the second surface of the interposer comprises interposer contacts disposed thereon, the interposer contacts are configured to facilitate electrical coupling between the interposer contact pads and an external device;

a first die on a first die attach region on the first surface of the interposer, the first die comprises a first surface with first conductive contacts thereon, wherein the interposer comprises material with CTE similar to that of the first die, the first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer;

a package substrate having first and second surfaces, wherein

the first surface of the package substrate comprises first substrate contact pads, the first substrate contact pads contact the interposer contacts on the second surface of the interposer, and

the second surface of the package substrate comprises external substrate contacts; and

an external component, wherein the external substrate contacts are coupled to the external component and serve as external package connections to form connections between the package substrate and the external component.

14. The semiconductor assembly in claim 13 wherein the external component comprises a circuit board.

15. The semiconductor assembly in claim 13 comprises an underfill in a space between the first die and the first surface of the interposer.

16. The semiconductor assembly in claim 15 comprising a second die on a second die attach region on the first surface of the interposer, the second die attach region is disposed on a periphery of the first die attach region.

17. The semiconductor assembly in claim 16 comprising an underfill disposed in a space between the first and second dies.

18. The semiconductor assembly in claim 13 comprising a second die on a second die attach region on the first surface of the interposer, the second die attach region is disposed on a periphery of the first die attach region.

19. A semiconductor assembly comprising:

an interposer with through interposer vias, the interposer comprises a first surface and a second surface, wherein

the through interposer vias extend from the first surface to the second surface of the interposer,

the first and second surfaces of the interposer comprise interposer contact pads thereon, the through interposer vias facilitate electrical coupling between the interposer contact pads on the first and second surfaces of the interposer, and

the second surface of the interposer comprises interposer contacts disposed thereon, the interposer contacts are configured to facilitate electrical coupling between the interposer contact pads and an external device;

a first die disposed on a first die attach region on the first surface of the interposer, the first die comprises a first surface with first conductive contacts thereon, wherein the interposer comprises material with CTE similar to that of the first die, the first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer;

a second die disposed on a second die attach region on the first surface of the interposer, the second die attach region is disposed on a periphery of the first die attach region;

a package substrate having first and second surfaces, wherein

the first surface of the package substrate comprises first substrate contact pads, the first substrate contact pads contact the interposer contacts on the second surface of the interposer, and

the second surface of the package substrate comprises external substrate contacts; and

an underfill disposed in a space between the first and second dies and the first surface of the interposer and an underfill disposed in a space between the interposer and package substrate.

20. The method of claim 11 comprising:

providing an external component which comprises a circuit board; and

coupling one of the individual semiconductor assemblies to the external component, wherein the external substrate contacts serve as external package connections to form connections between the package substrate and the external component.