Multi-die IC package and manufacturing method
View Patent ↗A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.
1. A method of manufacturing integrated circuit packages, comprising:
attaching a first die onto a first side of a set of leads;
applying an adhesive onto the set of leads at a second side opposite to the first side, wherein the adhesive is to fill into gaps defined by the set of leads;
attaching a second die onto the adhesive; and
curing the adhesive, wherein the first die is attached to the first side of the set of leads with a plurality of tape strips.
2. The method as recited in claim 1 , wherein the plurality of tape strips define a plurality of spaces, and wherein the adhesive fills the spaces prior to curing the adhesive.
3. The method as recited in claim 2 , wherein the adhesive is in contact with the first die.
4. The method as recited in claim 1 , wherein the adhesive is applied at the second side at a first region overlapping the spaces and a second region overlapping the plurality of tapes.
5. The method as recited in claim 4 , wherein the adhesive partially covers the first region and the second region.
6. A method of manufacturing integrated circuit packages, comprising:
attaching a first die onto a first side of a set of leads;
applying an adhesive onto the set of leads at a second side opposite to the first side, wherein the adhesive is to fill into gaps defined by the set of leads;
attaching a second die onto the adhesive; and
curing the adhesive, wherein the first die is attached to the set of leads via a single piece of tape, and wherein the single piece of tape separates the adhesive from the first die.
7. The method as recited in claim 6 , wherein the adhesive is in contact with the single piece of tape.
8. An integrated circuit package, comprising:
a set of leads disposed in a plane having a first side and an opposite second side, the set of leads defining a plurality of gaps between each lead;
a first die attached to the set of leads at the first side with a first bond;
a second die attached to the set of leads at the second side with a second bond;
wherein the second bond is to fill the plurality of gaps.
9. The integrated circuit package as recited in claim 8 , wherein the first bond comprises a plurality of separated tapes sandwiched between the first die and the set of leads.
10. The integrated circuit package as recited in claim 9 , wherein the plurality of tapes are separated from each other forming spaces therebetween.
11. The integrated circuit package as recited in claim 10 , wherein the second bond fills the spaces.
12. The integrated circuit package as recited in claim 8 , wherein the first bond is a single piece of tape separating the second bond from the first die.
13. The integrated circuit package as recited in claim 12 , wherein the second bond is in contact with the single piece of tape.
14. The integrated circuit package as recited in claim 8 , further comprising an encapsulation to cover the first die, the second die and a portion of the leads.