Semiconductor packages and methods of packaging semiconductor devices
View Patent ↗A method of forming semiconductor assemblies is disclosed. The method includes providing an interposer with through interposer vias. The interposer includes a first surface and a second surface. The through interposer vias extend from the first surface to the second surface of the interposer. A first die is mounted on the first surface of the interposer. The first die comprises a first surface with first conductive contacts thereon. The interposer comprises material with coefficient of thermal expansion (CTE) similar to that of the first die. The first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer.
1. A method of forming semiconductor assemblies comprising:
providing an interposer with through interposer vias, the interposer comprises a first surface and a second surface, wherein
the through interposer vias extend from the first surface to the second surface of the interposer,
the first and second surfaces of the interposer comprise interposer contact pads thereon, the through interposer vias facilitate electrical coupling between the interposer contact pads on the first and second surfaces of the interposer, and
the second surface of the interposer comprises interposer contacts disposed thereon, the interposer contacts are configured to facilitate electrical coupling between the interposer contact pads and an external device; and
mounting a first die on a first die attach region on the first surface of the interposer, the first die comprises a first surface with first conductive contacts thereon, wherein the interposer comprises material with coefficient of thermal expansion (CTE) similar to that of the first die, the first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer.
2. The method in claim 1 comprises performing a reflow process to form connections between the first die and interposer.
3. The method in claim 1 comprises dispensing an underfill into a space between the first die and the first surface of the interposer.
4. The method in claim 1 comprises mounting a second die on a second die attach region on the first surface of the interposer, the second die attach region is disposed on a periphery of the first die attach region.
5. The method in claim 4 comprises performing a reflow process to form connections between the first and second dies and interposer.
6. The method in claim 4 comprises dispensing an underfill into a space between the first and second dies and the first surface of the interposer.
7. The method in claim 4 comprising forming an encapsulant on the interposer, wherein the encapsulant encapsulates the first and second dies.
8. The method in claim 1 comprises forming an encapsulant on the interposer, wherein the encapsulant encapsulates the first die.
9. The method in claim 1 comprises providing a package substrate having first and second surfaces, the first surface of the package substrate comprises first substrate contact pads, wherein the first substrate contact pads contact the interposer contacts on the second surface of the interposer.
10. The method in claim 9 comprises forming external substrate contacts on the second surface of the package substrate, the external substrate contacts serve as external package connections.
11. The method in claim 9 comprising forming an encapsulant on the package substrate, wherein the encapsulant encapsulates the first and second dies and the interposer.
12. A semiconductor assembly comprises:
an interposer with through interposer vias, the interposer comprises a first surface and a second surface, wherein
the through interposer vias extend from the first surface to the second surface of the interposer,
the first and second surfaces of the interposer comprise interposer contact pads thereon, the through interposer vias facilitate electrical coupling between the interposer contact pads on the first and second surfaces of the interposer, and
the second surface of the interposer comprises interposer contacts disposed thereon, the interposer contacts are configured to facilitate electrical coupling between the interposer contact pads and an external device; and
a first die on a first die attach region on the first surface of the interposer, the first die comprises a first surface with first conductive contacts thereon, wherein the interposer comprises material with CTE similar to that of the first die, the first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer.
13. The semiconductor assembly in claim 12 comprises an underfill in a space between the first die and the first surface of the interposer.
14. The semiconductor assembly in claim 12 comprising an encapsulant disposed on the interposer, wherein the encapsulant encapsulates the first die.
15. The semiconductor assembly in claim 12 comprising a second die on a second die attach region on the first surface of the interposer, the second die attach region is disposed on a periphery of the first die attach region.
16. The semiconductor assembly in claim 15 comprising an underfill disposed in a space between the first and second dies and the first surface of the interposer.
17. The semiconductor assembly in claim 15 comprising an encapsulant disposed on the interposer, wherein the encapsulant encapsulates the first and second dies.
18. The semiconductor assembly of claim 12 comprising a package substrate having first and second surfaces, the first surface of the package substrate comprises first substrate contact pads, wherein the first substrate contact pads contact the interposer contacts on the second surface of the interposer.
19. The semiconductor assembly of claim 18 comprising external substrate contacts on the second surface of the package substrate, the external substrate contacts serve as external package connections.
20. The semiconductor assembly of claim 19 comprising an encapsulant disposed on the package substrate, wherein the encapsulant encapsulates the first and second dies and the interposer.