Packaged device with thermal enhancement and method of packaging
View Patent ↗A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.
1. A packaged semiconductor device, comprising:
a substrate having a semiconductor device attached to a first side of the substrate;
a plurality of guide members each comprising a pin;
a thermal transfer member provided on said first side of said substrate and positioned by at least one pin; and
a mold material that encapsulates said semiconductor device and at least part of said thermal transfer member.
2. A packaged device according to claim 1 , wherein part of said thermal transfer member is exposed outside said molding material.
3. A packaged device according to claim 1 , wherein said thermal transfer member is convex and extends over said semiconductor device.
4. A packaged device according to claim 1 , wherein part of said thermal transfer member is exposed outside said molding material.
5. A packaged device according to claim 1 , wherein said thermal transfer member is convex and extends over said semiconductor device.
6. A packaged device according to claim 5 , wherein part of said thermal transfer member is exposed outside said molding material.
7. A packaged device according to claim 1 , wherein each pin is attached to said substrate.
8. A packaged device according to claim 7 , wherein said thermal transfer member is convex and extends over said semiconductor device.
9. A packaged device according to claim 7 , wherein part of said thermal transfer member is exposed outside said molding material.
10. A packaged device according to claim 7 , wherein said thermal transfer member has notches corresponding to a total number of said pins.
11. A packaged device according to claim 10 , wherein said thermal transfer member is convex and extends over said semiconductor device.
12. A packaged device according to claim 10 , wherein part of said thermal transfer member is exposed outside said molding material.
13. A method of packaging a semiconductor device, comprising:
attaching a semiconductor device to a first surface of a substrate;
mounting at least one guide member to the substrate;
placing a thermal transfer member in contact with a portion of the substrate adjacent to the at least one guide member and spaced from an area of the substrate adjacent to the semiconductor device, peripheral portions of said thennal transfer member being positioned by the at least one guide member; and
encapsulating said semiconductor device and at least part of said thermal transfer device in a mold material.
14. A The method according to claim 13 , further comprising placing the thermal transfer member on the substrate when the substrate and an attached die are placed in a mold for encapsulating.
15. The method according to claim 13 , further comprising providing the thermal transfer member with peripheral notches, each configured to receive a pin.
16. The method according to claim 13 , wherein the thermal transfer member is located on the first surface of the substrate.
17. A The method according to claim 13 , further comprising providing a plurality of guide members, each comprising a pin attached to the substrate prior to attachment of the semiconductor device thereto.
18. A The method according to claim 17 , further comprising placing the thermal transfer member on the substrate when the substrate and an attached die are placed in a mold for encapsulating.
19. A packaged semiconductor device, comprising:
a substrate;
a semiconductor device attached to said substrate;
a thermal transfer member provided on said substrate;
at least one guide member that is mounted to the substrate and that connects said thermal transfer member to the substrate, wherein the thermal transfer member is in contact with a portion of the substrate adjacent the at least one guide member and spaced from an area of the substrate adjacent to the semiconductor device; and
a mold material that encapsulates said semiconductor device and at least a portion of said thermal transfer member.
20. The packaged semiconductor device according to claim 19 , wherein said at least one guide member comprises at least one pin attached to the substrate.
21. The packaged semiconductor device according to claim 19 , wherein said thermal transfer member extends over said semiconductor device and has a portion that is not encapsulated by the mold material.
22. The packaged semiconductor device according to claim 19 , wherein the thermal transfer member includes peripheral notches, each configured to receive a pin.
23. The packaged semiconductor device according to claim 19 , wherein the thermal transfer member is provided on the same side of the substrate as the semiconductor device.