Thermally enhanced semiconductor package and method of producing the same
View Patent ↗This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufacturing a semiconductor package that includes inserting a substrate with an attached semiconductor chip in a first mold portion, placing a heat sink structure on top of a portion of the substrate, placing a mold release film onto a second mold portion, clamping a second mold portion onto a portion of the heat sink structure, injecting an encapsulant into a mold cavity, wherein the encapsulant surrounds portions of the substrate, semiconductor chip and heat sink structure, curing the encapsulant, whereby the heat sink structure adheres to the encapsulant and singulating the encapsulated assembly to form a semiconductor package.
1. A heat sink structure for use in a semiconductor package having a substrate with an attached semiconductor chip comprising:
a ring structure with down sets; and
a heat sink connected along a same plane to said ring structure;
wherein said ring structure has a V-shaped down set extending from the plane to the substrate; and
wherein the heat sink is connected to the ring structure by etched tie bars.
2. The heat sink structure of claim 1 wherein the heat sink structure comprises a plurality of heat sinks.
3. The heat sink structure of claim 2 wherein the plurality of heat sinks are arranged in an array.
4. The heat sink structure of claim 3 further comprising a plurality of heat sink arrays.
5. The heat sink structure of claim 1 further comprising alignment elements.
6. The heat sink structure of claim 5 , wherein the alignment elements are holes.
7. The heat sink structure of claim 1 wherein the entire heat sink is in the plane.
8. The heat sink structure of claim 1 wherein the ring structure surrounds the heat sink.
9. The heat sink structure of claim 2 wherein the ring structure surrounds the plurality of heat sinks.