Patent Assignment
Reel/Frame 017413/0842
Assignment of Assignor's Interest
Recorded: 2005-07-26
Pages: 3
Assignors
GOH, KIM YONG
Executed: 2004-01-03
KAPOOR, RAHUL
Executed: 2004-01-30
SUN, ANTHONY YI-SHENG
Executed: 2004-01-30
CHONG, DESMOND YOK RUE
Executed: 2004-01-30
HOANG, LAN H.
Executed: 2004-02-03
Assignees
UNITED TEST AND ASSEMBLY CENTER LTD.
5 SERANGOON NORTH AVENUE 5, 554916, SINGAPORE
XILINX, INC.
2100 LOGIC DRIVE, SAN JOSE, CALIFORNIA, 95124
Covered Property
(1)
Molded High Density Electronic Packaging Structure for High Performance Applications
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement
Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Assignment of Assignor's Interest
Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →
Release of Security Interest
Jan 5, 2018
From: JPMORGAN CHASE BANK, N.A.
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 044549/0152 →