IP Library Assignment 018198/0103
Patent Assignment
Reel/Frame 018198/0103

Assignment of Assignor's Interest

Recorded: 2006-05-10 Pages: 2
Assignors
WANG, CHUEN KHIANG
Executed: 2006-03-29
TAN, HIEN BOON
Executed: 2006-03-29
SUN, ANTHONY YI SHENG
Executed: 2006-03-29
SONG, SIN NEE
Executed: 2006-03-29
YAO, STEVEN YU FENG
Executed: 2006-03-29
TAN, HUA HONG
Executed: 2006-03-29
Assignee
UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD.
5 SERANGOON NORTH AVENUE 5, 554916, SINGAPORE, SINGAPORE
Covered Property (1)
Semiconductor Chip Package and Method of Manufacture
Patent: 7,678,610 →
Application: 11/260,091 →
Publication: US 2006/0192292
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Assignment of Assignor's Interest Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment. Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment. Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →
Release of Security Interest Jan 5, 2018
From: JPMORGAN CHASE BANK, N.A.
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 044549/0152 →