Leadframe enhancement and method of producing a multi-row semiconductor package
View Patent ↗A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.
1. A semiconductor package comprising:
a plurality of first leads, each with a top outer portion removed from said lead and an outer end;
a plurality of second leads, each with a bottom outer portion removed from said lead and an outer end;
wherein said first and said second leads alternate with each other along an edge of said package;
wherein the outer ends of said first leads form a first row along the edge of said package and the outer ends of said second leads form a second row along the edge of said package.
2. The package of claim 1 wherein said first and second rows are parallel to each other.
3. The package of claim 2 , further comprising a integrated circuit and a plurality of wires connecting said integrated circuit to said first and second leads.
4. The package of claim 2 , further comprising an encapsulant that covers at least a portion of said first and second leads.
5. The package of claim 4 wherein said encapsulant covers the entire top and entire sides of said first leads, but does not cover the outer ends of said first leads; and
wherein said encapsulant covers a portion of the top of said second leads and the entire sides of said second leads, but does not cover the outer ends of said second leads.
6. The package of claim 4 wherein said encapsulant forms a flange at an outer edge of said package.
7. The package of claim 4 wherein said encapsulant covers the entire top and entire sides of said first and second leads, but does not cover the outer ends of said first and second leads.
8. The package of claim 7 wherein said encapsulant forms a flange at the outer edge of said package.
9. A leadframe comprising:
a plurality of first leads, each with a top outer portion removed from said lead and an outer end;
a plurality of second leads, each with a bottom outer portion removed from said lead and an outer end;
wherein said first and said second leads alternate with each other along an edge of said leadframe;
wherein the outer ends of said first leads form a first row along the edge of said leadframe and the outer ends of said second leads form a second row along the edge of said leadframe.