High density chip scale leadframe package and method of manufacturing the package
View Patent ↗An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantially around the die pad. The package also comprises a plurality of outer leads disposed substantially co-planar with and substantially around the plurality of inner leads and the die pad, so that the sides of each of the plurality of outer leads are offset from the sides of each of the plurality of inner leads. A first adhesive layer disposed on the first face of the die pad and a second adhesive layer disposed on the first faces of each of the plurality of inner leads. An IC chip is coupled to the first face of the die pad through the first adhesive layer and to the plurality of inner leads through the second adhesive layer. The package further comprises wires linking the inner leads and outer leads to the IC chip.
1. A leadframe for an integrated circuit package, comprising: an outer frame portion;
a die pad portion substantially centrally disposed within said outer frame portion;
a plurality of inner lead portions extending substantially radially outward from said central die pad portion;
a plurality of outer lead portions extending substantially radially inward from said outer frame portion; said leadframe having a first face and a second face, wherein a dimple is formed on the first face of each of said plurality of inner lead portions, and a plurality of dimples are formed on the first face of said die pad portion; and a plurality of tie bars connecting said die pad portion to said outer frame portion.
2. The leadframe according to claim 1 , wherein the leadframe is composed of a common copper alloy.
3. The leadframe according to claim 1 , wherein said inner lead portions are connected to said central die pad portion.
4. The leadframe according to claim 1 , wherein there is a gap between said inner lead portions and said outer lead portions.
5. A leadframe for an integrated circuit package, comprising:
an outer frame portion;
a die pad portion substantially centrally disposed within said outer frame portion;
a plurality of tie bars connecting said die pad portion to said outer frame portion;
a plurality of protuberances extending substantially radially inward from said outer frame portion, each of said plurality of protuberances comprising:
an inner lead portion,
an outer lead portion, and
a post portion connecting said inner lead portion to said outer lead portion, said post portion having a substantially smaller width than either said inner lead portion or said outer lead portion.
6. The leadframe according to claim 5 , having a first face and a second face,
wherein
a dimple is formed on the first face of each of said plurality of inner lead portions, and
a plurality of dimples are formed on the first face of said die pad portion.
7. The leadframe according to claim 5 , wherein the leadframe is composed of a common copper alloy.