IP Library › Assignment 044624/0017
Patent Assignment
Reel/Frame 044624/0017

Assignment of Assignor's Interest

Recorded: 2018-01-15 Pages: 7
Assignor
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Properties (2)
High Density Chip Scale Leadframe Package and Method of Manufacturing the Package
Patent: 7,345,357 →
Application: 11/205,182 →
Publication: US 2005/0275077
High Performance Chip Scale Leadframe Package with Thermal Dissipating Structure and Annular Element and Method of Manufacturing Package
Patent: 7,323,769 →
Application: 11/429,248 →
Publication: US 2006/0202313
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Release of Security Interest Jan 5, 2018
From: JPMORGAN CHASE BANK, N.A.
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 044549/0152 →