Patent Assignment
Reel/Frame 018854/0010
Assignment of Assignor's Interest
Recorded: 2007-01-30
Pages: 3
Assignors
CHEN, FUNG LENG
Executed: 2004-06-24
KIM, SEONG KWANG BRANDON
Executed: 2004-06-24
CHA, WEE LIM
Executed: 2004-06-24
SUN, YI-SHENG ANTHONY
Executed: 2004-06-24
HETZEL, WOLFGANG JOHANNES
Executed: 2004-07-12
THOMAS, JOCHEN
Executed: 2004-07-14
Assignees
UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD.
5 SERANGOON NORTH AVENUE 5, 554916, SINGAPORE, SINGAPORE
INFINEON TECHNOLOGIES
BALANSTRASSE 73, 81541 MUNICH, GERMANY
Covered Property
(1)
Multi-Chip Ball Grid Array Package and Method of Manufacture
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 6, 2007
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020072/0018 →
Security Agreement
Apr 28, 2008
From: UNITED TEST AND ASSEMBLY CENTER LTD.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020866/0116 →
Release of Security Interest
Jan 5, 2018
From: JPMORGAN CHASE BANK, N.A.
To: UNITED TEST AND ASSEMBLY CENTER LTD.
Reel/Frame 044549/0152 →