Patent Assignment
Reel/Frame 018819/0064
Assignment of Assignor's Interest
Recorded: 2007-01-29
Pages: 8
Assignors
LEE, HI-KUK
Executed: 2007-01-10
JEON, WOO-SEOK
Executed: 2007-01-10
JUNG, DOO-HEE
Executed: 2007-01-10
PARK, JEONG-MIN
Executed: 2007-01-10
KANG, DEOK-MAN
Executed: 2007-01-10
JUNG, SI-YOUNG
Executed: 2007-01-10
CHOI, JAE-YOUNG
Executed: 2007-01-10
Assignees
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
AZ ELECTRONIC MATERIALS (JAPAN) K.K.
BUNKYO GREEN COURT, 28-8, HONKOMAGOME 2CHOME, BUNKYO-KU, TOKYO, 113-0021, JAPAN
Covered Property
(1)
Photoresist Composition and Method of Manufacturing a Thin-Film Transistor Substrate Using the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 21, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029019/0139 →
Assignment of Assignor's Interest
Dec 7, 2012
From: AZ ELECTRONIC MATERIALS (JAPAN) K.K.
To: AZ ELECTRONIC MATERIALS (KOREA) LTD.
Reel/Frame 029424/0441 →
Assignment of Assignor's Interest
Jan 4, 2017
From: MERCK ELECTRONIC MATERIALS LTD.
To: MERCK PATENT GMBH
Reel/Frame 040838/0326 →
Change of Name
Jan 5, 2017
From: MERCK ELECTRONIC MATERIALS LTD.
To: MERCK PATENT GMBH
Reel/Frame 041260/0210 →
Change of Name
Feb 23, 2022
From: AZ ELECTRONIC MATERIALS KOREA LTD.
To: MERCK ELECTRONIC MATERIALS LTD.
Reel/Frame 059327/0876 →
Assignment of Assignor's Interest
Jul 19, 2024
From: MERCK PATENT GMBH
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 068028/0351 →