IP Library Assignment 018823/0268
Patent Assignment
Reel/Frame 018823/0268

Assignment of Assignor's Interest

Recorded: 2007-01-30 Pages: 3
Assignors
LI, WAI-KIN
Executed: 2006-12-15
YANG, HAINING S.
Executed: 2006-12-15
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Sub-Lithographic Interconnect Patterning Using Self-Assembling Polymers
Patent: 7,767,099 →
Application: 11/627,488 →
Publication: US 2008/0182402
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 26, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 054528/0023 →