IP Library › Assignment 018823/0315
Patent Assignment
Reel/Frame 018823/0315

Assignment of Assignor's Interest

Recorded: 2007-01-17 Pages: 2
Assignor
KAMINS, THEODORE I.
Executed: 2007-01-10
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
Methods of Forming Through-Substrate Interconnects
Patent: 7,566,657 →
Application: 11/654,338 →
Publication: US 2008/0171430
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →