IP Library › Assignment 018830/0364
Patent Assignment
Reel/Frame 018830/0364

Assignment of Assignor's Interest

Recorded: 2007-01-25 Pages: 3
Assignors
GOLDSMAN, NEIL
Executed: 2006-09-26
AKTURK, AKIN
Executed: 2006-04-28
Assignee
MARYLAND, UNIVERSITY OF
6200 BALTIMORE AVENUE, SUITE 300, COLLEGE PARK, MARYLAND, 20742-9520
Covered Property (1)
Use of Thermally Conductive Vias to Extract Heat from Microelectronic Chips and Method of Manufacturing
Patent: 7,286,359 →
Application: 10/842,731 →
Publication: US 2005/0254215
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 25, 2005
From: KHBEIS, MICHAEL T.; METZE, GEORGE M.
To: NATIONAL SECURITY AGENCY
Reel/Frame 016484/0473 →
Confirmatory License Apr 25, 2005
From: UNIVERSITY OF MARYLAND
To: NATIONAL SECURITY AGENCY
Reel/Frame 016484/0527 →
Confirmatory License Sep 26, 2007
From: UNIVERISTY OF MARYLAND
To: NATIONAL SECURITY AGENCY
Reel/Frame 020013/0701 →
Confirmatory Assignment Feb 17, 2011
From: KHBEIS, MICHAEL T.; METZE, GEORGE M.
To: NATIONAL SECURITY AGENCY
Reel/Frame 025824/0295 →