Assignment of Assignor's Interest

Recorded: 2007-01-22 Pages: 3

Assignor

SHIMIZU, HIROSHI

Executed: 2006-12-22

Assignee

SEIKO EPSON CORPORATION

4-1, NISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN

Covered Property (1)

Mold Forming Method and Apparatus, and Plastic Lens Manufacturing Method and Apparatus

Patent: 8,262,951 →

Application: 11/655,922 →

Publication: US 2007/0170557

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.