Assignment of Assignor's Interest

Recorded: 2007-01-25 Pages: 2

Assignor

HONDA, HIROKAZU

Executed: 2007-01-05

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Interconnect substrate and semiconductor device

Application: 11/657,571 →

Publication: US 2007/0178686

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.