Patent Assignment
Reel/Frame 025311/0860
Change of Name
Recorded: 2010-11-04
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Testing System and Testing Method
Apparatus and Method for Selectively Removing Audio Frames Based on Speech, Non-Speech and Silence Decision for Audio Reproduction
Application:
11/649,226 →
Publication:
US 2007/0192089
Clock and Data Recovery Circuit and Serdes Circuit
Substrate and Semiconductor Device
Scan Flip-Flop Circuit and Semiconductor Integrated Circuit Device
Semiconductor Apparatus Manufacturing Method
Abnormality Detection System and Method of Detecting Abnormality
Apparatus and Method for Power Conversion Having Diode in Charging and Discharging Circuit
Multiprocessor System and Boot-Up Method of Slave System
Method of Manufacturing a Semiconductor Device
Semiconductor device and manufacturing method thereof
Application:
11/655,986 →
Publication:
US 2007/0170499
Semiconductor Device with a Plurality of Power Supply Systems
Semiconductor Device Featuring Common Capacitor Electrode Layer, and Method for Manufacturing Such Semiconductor Device
Differential Signal Receiver
Reference Voltage Circuit Driven by Non-Linear Current Mirror Circuit
Semiconductor Memory Device
Patent:
41,880 →
Application:
11/657,380 →
Voltage Reference Circuit Compensated for Non-Linearity in Temperature Characteristic of Diode
Interconnect substrate and semiconductor device
Application:
11/657,571 →
Publication:
US 2007/0178686
Transparent Epoxy Resin Composition for Molding Optical Semiconductor and Optical Semiconductor Integrated Circuit Device Using the Same
Nonvolatile Semiconductor Memory Device and Method of Writing Data into the Same
Nonvolatile Semiconductor Memory Device with Trench Structure
Application:
11/675,428 →
Publication:
US 2007/0187746
Display Panel Including Amplifier with Offset Canceling by Reversing Polarity of Amplifier Offset
Multichip Device
Signal Amplifier
Semiconductor Device Having Mim Capacitive Elements and Manufacturing Method for the Same
Optical Disk Apparatus, Laser Power Controller, and Laser Power Control Method
Semiconductor Integrated Circuit Device and Method of Testing Same
Signal Amplifier Circuit and Optical Receiver
Semiconductor Device Manufacturing Apparatus and Semiconductor Device Manufacturing Method
Parallel Conversion Circuit
Drive Circuit Containing Amplifier Circuit
Clock and Data Recovery Circuit
Method of Forming a High-K Film on a Semiconductor Device
Circuit and method for loop control in a pipeline process
Application:
11/700,114 →
Publication:
US 2007/0186084
Semiconductor Device and Method of Adding Tester Circuit for the Same
Semiconductor Memory Device
Semiconductor Memory Device
Internal Voltage Level Control Circuit and Semiconductor Memory Device as Well as Method of Controlling the Same
Semiconductor Wafer Testing Apparatus and Method of Testing Semiconductor Wafer
Electronic Device Substrate, Electronic Device and Methods for Fabricating the Same
Semiconductor Device and Method for Manufacturing Same
Method of Forming Molded Resin Semiconductor Device
Ion Implanting Apparatus for Forming Ion Beam Geometry
Semiconductor Device with Interconnection Structure for Reducing Stress Migration
Deposition Apparatus and Method for Depositing Film
Semiconductor memory device with narrow low threshold voltage distribution
Application:
11/704,934 →
Publication:
US 2007/0189077
Semiconductor Device and Method for Manufacturing Same
Apparatus for Monitoring the Voltage of a Battery Pack Having a Plurality of Battery Cells Connected in Series
Operational Amplifier
Method of Manufacturing a Semiconductor Device and Wet Processing Apparatus
Optical Unit Featuring Both Photoelectric Conversion Chip and Semiconductor Chip Wrapped with Flexible Sheet
Power Supply Selection/Detection Circuit
Method for Manufacturing Semiconductor Package Capable of Potting Thermosetting Resin While Being Heated
Synchronization Timing Detecting Apparatus, Receiving Apparatus, and Synchronization Timing Detecting Method
Triangular-Wave Generating Apparatus Incorporating Capacitor
Semiconductor Integrated Circuit Device and Dummy Pattern Arrangement Method
Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit Apparatus and Control Method Thereof
Semiconductor Device
Imaging Device
Spread Spectrum Block Control Apparatus and Spread Spectrum Clock Generating Apparatus
Apparatus and method for memory control, and mobile device
Application:
11/714,749 →
Publication:
US 2007/0220218
Imaging Apparatus and Exposure Control Method Thereof
Photomask and Exposure Method
Pwm Current Controlling Apparatuses Capable of Optimally Correcting Load Current
Apparatus, Method, and Program Product for Color Correction
Method for Depositing Film and Method for Manufacturing Semiconductor Device
Spread Spectrum Block Control Apparatus and Spread Spectrum Clock Generating Apparatus
Semiconductor Device
Semiconductor Storage Device
Method and Device for Producing Layout Patterns of a Semiconductor Device Having an Even Wafer Surface
Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
Application:
11/720,066 →
Publication:
US 2008/0001288
Semiconductor Device Having a Buffer Layer in a Throughhole and Method of Manufacturing Same
Application:
11/722,702 →
Publication:
US 2008/0224271
Limiter Circuit
Semiconductor Apparatus and Test Method Therefor
Data scramble/descramble technique for improving data security within semiconductor device
Application:
11/723,206 →
Publication:
US 2007/0217608
Semiconductor Device and Method of Manufacturing the Same
Complementary Signal Generating Circuit
Semiconductor Integrated Circuit Device
Semiconductor Storage Device
Bolt and Semiconductor Manufacturing Apparatus
Solid-State Imaging Device and Method of Operating Solid-State Imaging Device
Method of Manufacturing Semiconductor Apparatus
Multilayer Interconnection Board, Semiconductor Device Having the Same, and Method of Forming the Same as Well as Method of Mounting the Semicondutor Chip on the Interconnection Board
Failure Detection Apparatus and Failure Detection Method for a Semiconductor Apparatus
Split gate type non-volatile semiconductor memory device and method of manufacturing the same
Application:
11/727,172 →
Publication:
US 2007/0221987
Receiving Circuit and Receiving Method
Semiconductor Device
Semiconductor Integrated Circuit Device and Delay Fault Testing Method
Solid-State Image Sensing Device and Method of Operating the Same
Receiving Circuit and Receiving Method
Lead Cutter and Method of Fabricating Semiconductor Device
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2007
From: TAKEUCHI, MASAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018763/0606 →
Assignment of Assignor's Interest
Jan 4, 2007
From: HARADA, EIJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018776/0197 →
Assignment of Assignor's Interest
Jan 8, 2007
From: TANAKA, TAKEKAZU; TAKAHASHI, KOUHEI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018773/0855 →
Assignment of Assignor's Interest
Jan 8, 2007
From: MIWA, SHUNJIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018779/0876 →
Assignment of Assignor's Interest
Jan 8, 2007
From: EJIMA, DAISUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018779/0899 →
Assignment of Assignor's Interest
Jan 16, 2007
From: HIGASHIDE, MASANOBU; SADAKUNI, GOUKI
To: NEC ELECTRONICS CORPORATION; NEC CORPORATION
Reel/Frame 018810/0957 →
Assignment of Assignor's Interest
Jan 17, 2007
From: ITO, YOUICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018823/0891 →
Assignment of Assignor's Interest
Jan 19, 2007
From: UEMURA, MARIKO; SUDA, KEI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018810/0203 →
Assignment of Assignor's Interest
Jan 19, 2007
From: SASAKI, YOICHI; OHTO, KOICHI; MORITA, NOBORU; USAMI, TATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018825/0207 →
Assignment of Assignor's Interest
Jan 22, 2007
From: ARAKI, NORIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018822/0763 →
Assignment of Assignor's Interest
Jan 23, 2007
From: TANAKA, MASANORI; HIRATA, MORIHISA; OKAMOTO, HITOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018838/0103 →
Assignment of Assignor's Interest
Jan 23, 2007
From: AOKI, YASUYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018827/0589 →
Assignment of Assignor's Interest
Jan 23, 2007
From: MURATA, TOSHIKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018827/0620 →
Assignment of Assignor's Interest
Jan 24, 2007
From: KIMURA, KATSUJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018834/0027 →
Assignment of Assignor's Interest
Jan 25, 2007
From: KIMURA, KATSUJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018842/0583 →
Assignment of Assignor's Interest
Jan 25, 2007
From: HONDA, HIROKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018842/0762 →
Assignment of Assignor's Interest
Apr 20, 2007
From: FUKUDA, MASAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019198/0033 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →