Bolt and semiconductor manufacturing apparatus
A bolt includes a main body and a spring pin. The main body includes a head and a shaft. The spring pin includes a base portion and an end portion. The shaft includes a portion of external thread and a hollow portion. The head includes a top surface and a hole opened in the top surface. The hole is connected to the hollow portion. The base portion is arranged in the hollow potion to move along an axis of the main body. The end portion is arranged in the hole to move along the axis. The spring pin is energized toward a side of the head such that the end portion protrudes beyond the top surface. The end portion is electrically connected to the portion of external thread.
1. A bolt comprising:
a main body including a head and a shaft; and
a spring pin including a base portion and an end portion,
wherein said shaft includes a portion of external thread and a hollow portion,
said head includes a top surface and a hole opened in said top surface,
said hole is connected to said hollow portion,
said base portion is arranged in said hollow potion to move along an axis of said main body,
said end portion is arranged in said hole to move along said axis,
said spring pin is energized toward a side of said head such that said end portion protrudes beyond said top surface, and
said end portion is electrically connected to said portion of external thread.
2. The bolt according to claim 1 , wherein a portion of said hole is a hexagon hole, and
said portion of said hole is opened in said top surface.
3. The bolt according to claim 1 , further comprising:
a set screw; and
a helical compression spring,
wherein said set screw is screwed in an opening portion of said hollow potion,
said opening portion is opened in a end of said shaft, and
said helical compression spring is arranged in said hollow portion between said base portion and said set screw.
4. A semiconductor manufacturing apparatus comprising:
a wafer holding device for holding a wafer;
an ion beam irradiating apparatus for irradiating ion beam to said wafer;
a support supporting said wafer holding device; and
a bolt tightening said wafer holding device to said support,
wherein said bolt includes a main body and a spring pin,
said main body includes a head and a shaft,
said shaft includes a portion of external thread and a hollow portion,
said spring pin includes a base portion and an end portion,
said head includes a top surface and a hole opened in said top surface,
said hole is connected to said hollow portion,
said base portion is arranged in said hollow potion to move along an axis of said main body,
said end portion is arranged in said hole to move along said axis,
said support includes a portion of internal thread in which said portion of external thread is screwed,
said wafer holding device includes a base having a supporting surface,
said supporting surface contacts to a back surface of said wafer,
said base includes a spot facing hole opened in said supporting surface and a shaft hole connecting said spot facing hole to said portion of internal thread,
said head is arranged in said spot facing hole,
said spring pin is energized toward a side of said head such that said end portion protrudes beyond said top surface,
said end portion is electrically connected to said portion of external thread, and
said support is grounded.
5. The semiconductor manufacturing apparatus according to claim 4 , wherein said support is a shaft of a motor.
6. The semiconductor manufacturing apparatus according to claim 5 , wherein said wafer holding device includes a clamp ring pressing a peripheral portion of said wafer to said base.
7. The semiconductor manufacturing apparatus according to claim 4 , wherein said wafer holding device includes a bipolar type electrostatic chuck.