Semiconductor device with a plurality of power supply systems

1. A semiconductor integrated circuit device, comprising:

a plurality of power supply systems;

a signal line through which signal transfer is performed between a circuit in one power supply system and a circuit in an other power supply system;

an inverter circuit that outputs an inverted signal of an input signal to said signal line;

a control circuit that, when an abnormal voltage is applied to said one power supply system redirects a current flowing from the circuit in said one power supply system into said signal line to ground;

a switch provided between the inverter circuit and a power supply in said first power supply system, the switch being controlled by said control circuit; and

a capacitance element and a resistance element being provided in the control circuit, the capacitance element being connected between a gate of the switch and a power supply in said first power supply system.

2. The semiconductor integrated circuit according to claim 1 , wherein said switch restrains a current flowing from one transistor in said one power supply system into an other transistor in said other power system, said one transistor outputting a signal to said signal line: said other transistor receiving the signal, through said signal line.

3. The semiconductor integrated circuit device according to claim 2 , wherein said control circuit comprises a circuit that restrains the current flowing into said other transistor in said other power supply system when the abnormal voltage is applied to said other power supply system.

4. A semiconductor integrated circuit device, comprising:

an output circuit with power thereof supplied from a first power supply system;

an input circuit with power thereof supplied from a second power supply system;

a signal line through which signal transfer is performed between the output circuit and the input circuit;

a circuit that when an ESD (Electro-Static Discharge) stress is applied to a signal transmitting/receiving portion of said output circuit and said input circuit, redirects a current flowing into said signal line to a ground;

an inverter circuit that outputs an inverted signal of an input signal to said signal line;

a transistor with a current thereof being adjustably controlled according to a signal supplied to a control terminal thereof, said transistor being disposed at least one of between said inverter circuit and a high potential side power supply terminal in said first power supply system and between said inverter circuit and a low potential side power supply terminal in said first power supply system; and

a series circuit comprising a capacitance element and a resistance element being disposed between the high potential side power supply terminal in said first power supply system and the low potential side power supply terminal in said first power supply system and a connecting point between said capacitance element and said resistance element is connected to the control terminal of the transistor.

5. The semiconductor integrated circuit device according to claim 4 , wherein at least two cascade connected transistors are arranged at least one of between said signal line and the high potential side power supply terminal in said first power supply system and between said signal line and the low potential side power supply terminal in said first power supply system.

6. The semiconductor integrated circuit device according to claim 4 , wherein one of source and drain diffusion layers of the transistor and a tap that gives a potential to a well with the diffusion layer formed therein are arranged in contact with each other, the transistor being connected at least one of between said output circuit and the high potential side power supply terminal in said first power supply system and between said output circuit and the low potential side power supply terminal in said first power supply system, said tap being of a conductive type opposite to a conductive type of the diffusion layer.

7. The semiconductor integrated circuit device according to claim 4 , wherein an ESD protection element is disposed between high and low potential side power supply terminals of said output circuit in said first power supply system and an ESD protection element is disposed between high and low potential side power supply terminals of said input circuit in said second power supply system.

8. The semiconductor integrated circuit according to claim 1 ,

wherein when an electric charge is applied to the capacitance element when a stress current is applied to the power supply in said first power supply system to open the switch to bypass a current through the circuit in the first power supply system.