IP Library › Assignment 018853/0632
Patent Assignment
Reel/Frame 018853/0632

Assignment of Assignor's Interest

Recorded: 2007-02-05 Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2006-12-04
CHIOU, WN-CHIH
Executed: 2006-12-04
WU, WENG-JIN
Executed: 2006-12-04
TU, HUNG-JUNG
Executed: 2006-12-04
YANG, KU-FENG
Executed: 2006-12-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Three-Dimensional Integrated Circuits with Protection Layers
Patent: 7,812,459 →
Application: 11/641,324 →
Publication: US 2008/0142990
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →