Patent Assignment
Reel/Frame 018865/0967
Assignment of Assignor's Interest
Recorded: 2007-02-08
Pages: 3
Assignors
HUANG, CHENG-HUNG
Executed: 2007-02-04
LIN, HSIEN-CHIEH
Executed: 2007-02-04
CHIANG, KUO-CHUN
Executed: 2007-02-04
HO, SHING-FUN
Executed: 2007-02-04
Assignee
NAN YA PRINTED CIRCUIT BOARD CORPORATION
338, SEC. 1, NANKAN ROAD, LUCHU, TAOYUAN, TAIWAN
Covered Property
(1)
Embedded Chip Package with Improved Heat Dissipation Performance and Method of Making the Same