Patent Assignment
Reel/Frame 018893/0021
Assignment of Assignor's Interest
Recorded: 2007-02-12
Pages: 3
Assignor
ROH, HYOUNG-HO
Executed: 2007-01-08
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Method of Manufacturing Semiconductor Package Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 13, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO., LTD.
Reel/Frame 032880/0089 →
Security Interest
Jul 1, 2024
From: DETECTOR ELECTRONICS, LLC (F/K/A DETECTOR ELECTRONICS CORPORATION); FIREYE, LLC (F/K/A FIREYE INC.); DETECTOR ELECTRONICS BUYER US, LLC; FIREYE BUYER, LLC
To: ALTER DOMUS (US) LLC, AS AGENT
Reel/Frame 068102/0675 →