IP Library › Assignment 032880/0089
Patent Assignment
Reel/Frame 032880/0089

Assignment of Assignor's Interest

Recorded: 2014-05-13 Pages: 5
Assignor
SAMSUNG TECHWIN CO., LTD.
Executed: 2014-04-30
Assignee
MDS CO., LTD.
84, JEONGDONG-RO, SEONGSAN-GU, CHANGWON-SI, GYEONGSANGNAM-DO, 641-120, KOREA, REPUBLIC OF
Covered Properties (14)
Printed Circuit Board Having Structure for Relieving Stress Concentration, and Semiconductor Chip Package Equipped with the Same
Patent: 7,804,693 →
Application: 11/167,858 →
Publication: US 2006/0016619
Lead Frame for Semiconductor Package
Patent: 7,285,845 →
Application: 11/194,285 →
Publication: US 2006/0231931
Printed Circuit Board and Method of Manufacturing the Same
Patent: 7,470,461 →
Application: 11/244,649 →
Publication: US 2006/0105153
Printed Circuit Board and Method of Manufacturing Semiconductor Package Using the Same
Patent: 7,750,456 →
Application: 11/651,670 →
Publication: US 2007/0160817
Plasma Display Panel, Method of Manufacturing Electrode Burying Dielectric Wall of Display Panel and Method of Manufacturing Electrode Burying Dielectric Wall of the Plasma Display Panel
Patent: 7,815,481 →
Application: 11/706,706 →
Publication: US 2007/0200500
Method of Manufacturing Multi-Layer Circuit Board
Patent: 8,227,173 →
Application: 12/156,513 →
Publication: US 2009/0098478
Lead Frame, Semiconductor Package Including the Lead Frame and Method of Forming the Lead Frame
Patent: 7,952,175 →
Application: 12/217,195 →
Publication: US 2009/0014854
A Method of Manufacturing a Printed Circuit Board (Pcb)
Patent: 8,122,599 →
Application: 12/288,740 →
Publication: US 2009/0107699
Roll-To-Roll Substrate Transfer Apparatus, Wet Etching Apparatus Comprising the Same and Apparatus for Manufacturing Printed Circuit Board
Patent: 8,128,752 →
Application: 12/317,562 →
Publication: US 2009/0159210
Printed Circuit Board and Method of Manufacturing the Same
Patent: 7,811,626 →
Application: 12/328,077 →
Publication: US 2009/0087547
Circuit Board Viaholes and Method of Manufacturing the Same
Patent: 8,278,564 →
Application: 12/432,898 →
Publication: US 2009/0283316
Printed Circuit Board with Multiple Metallic Layers and Method of Manufacturing the Same
Patent: 8,409,726 →
Application: 12/475,764 →
Publication: US 2010/0116528
Circuit Board and Method of Manufacturing the Same
Patent: 8,431,029 →
Application: 12/492,382 →
Publication: US 2010/0000776
Circuit Board Viaholes and Method of Manufacturing the Same
Application: 13/542,233 →
Publication: US 2012/0279775
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 16, 2009
From: RYU, JAE-CHUL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022119/0288 →
Assignment of Assignor's Interest Feb 13, 2009
From: KIM, DEOK-HEUNG
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022254/0186 →
Assignment of Assignor's Interest May 27, 2009
From: SHIM, CHANG-HAN; KANG, SUNG-IL; PARK, SE-CHUEL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022737/0248 →
Change of Name Apr 16, 2015
From: MDS CO., LTD.
To: HAESUNG DS CO., LTD.
Reel/Frame 035447/0366 →
Security Interest Jul 1, 2024
From: DETECTOR ELECTRONICS, LLC (F/K/A DETECTOR ELECTRONICS CORPORATION); FIREYE, LLC (F/K/A FIREYE INC.); DETECTOR ELECTRONICS BUYER US, LLC; FIREYE BUYER, LLC
To: ALTER DOMUS (US) LLC, AS AGENT
Reel/Frame 068102/0675 →