Printed circuit board and method of manufacturing the same
View Patent ↗Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.
1. A method of manufacturing a printed circuit board, the method comprising:
forming a parallelepiped-shaped prepreg having a volume via a reel-based process, wherein the prepreg layer has a thickness of about 0.15 mm, and a first CTE, and wherein the prepreg layer comprises a fiber material and a resin material that, when cured, encapsulates the fiber material, wherein the content of the resin material in the prepreg layer is about no greater than about 70% by volume;
forming a circuit pattern on at least one surface of the generally parallelepiped-shaped prepreg; and
forming a protection layer only on the circuit pattern, the protection layer having a second CTE, a difference of about 50 ppm is between the first CTE and the second CTE concentrating on the fiber layer bending stresses due to thermal expansion or via hole punching.
2. The method of claim 1 , wherein the fiber material comprises glass fiber.
3. The method of claim 1 , wherein the conductive film comprises copper.
4. The method of claim 1 , wherein the prepreg layer is comprised of at least two unit prepreg layers.
5. The method of claim 1 , wherein the circuit pattern is predetermined.
6. The method of claim 1 , wherein the step of forming the prepreg layer comprises controlling the amount of filler added to the resin material in order to control a coefficient of thermal expansion of the prepreg layer.
7. The method of claim 1 , further comprises:
attaching a conductive film on both sides of the prepreg layer; and
forming a via hole in the prepreg layer.