IP Library › Assignment 035447/0366
Patent Assignment
Reel/Frame 035447/0366

Change of Name

Recorded: 2015-04-16 Pages: 13
Assignor
MDS CO., LTD.
Executed: 2014-09-01
Assignee
HAESUNG DS CO., LTD.
726, UNGNAM-RO, SEONGSAN-GU, CHANGWON-SI, GYEONGSANGNAM-DO, 642-120, KOREA, REPUBLIC OF
Covered Properties (9)
Printed Circuit Board Having Structure for Relieving Stress Concentration, and Semiconductor Chip Package Equipped with the Same
Patent: 7,804,693 →
Application: 11/167,858 →
Publication: US 2006/0016619
Lead Frame for Semiconductor Package
Patent: 7,285,845 →
Application: 11/194,285 →
Publication: US 2006/0231931
Method of Manufacturing Multi-Layer Circuit Board
Patent: 8,227,173 →
Application: 12/156,513 →
Publication: US 2009/0098478
A Method of Manufacturing a Printed Circuit Board (Pcb)
Patent: 8,122,599 →
Application: 12/288,740 →
Publication: US 2009/0107699
Roll-To-Roll Substrate Transfer Apparatus, Wet Etching Apparatus Comprising the Same and Apparatus for Manufacturing Printed Circuit Board
Patent: 8,128,752 →
Application: 12/317,562 →
Publication: US 2009/0159210
Circuit Board Viaholes and Method of Manufacturing the Same
Patent: 8,278,564 →
Application: 12/432,898 →
Publication: US 2009/0283316
Printed Circuit Board with Multiple Metallic Layers and Method of Manufacturing the Same
Patent: 8,409,726 →
Application: 12/475,764 →
Publication: US 2010/0116528
Circuit Board and Method of Manufacturing the Same
Patent: 8,431,029 →
Application: 12/492,382 →
Publication: US 2010/0000776
Circuit Board Viaholes and Method of Manufacturing the Same
Application: 13/542,233 →
Publication: US 2012/0279775
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 10, 2005
From: JANG, CHANG-SOO; RYU, JAE-CHUL; HAN, SEONG-YOUNG
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016627/0253 →
Assignment of Assignor's Interest Aug 31, 2005
From: KANG, SUNG-IL; PARK, SE-CHUEL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016704/0143 →
Assignment of Assignor's Interest Jul 9, 2008
From: RYU, JAE-CHUL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 021211/0107 →
Assignment of Assignor's Interest Jan 16, 2009
From: RYU, JAE-CHUL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022119/0288 →
Assignment of Assignor's Interest Feb 13, 2009
From: KIM, DEOK-HEUNG
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022254/0186 →
Assignment of Assignor's Interest May 27, 2009
From: SHIM, CHANG-HAN; KANG, SUNG-IL; PARK, SE-CHUEL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022737/0248 →
Assignment of Assignor's Interest Jun 18, 2009
From: SHIM, CHANG-HAN; KANG, SUNG-IL; PARK, SE-CHUEL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022842/0668 →
Assignment of Assignor's Interest Aug 24, 2009
From: KIM, DEOK-HEUNG; KWON, YOUNG-DUCK
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 023136/0517 →
Assignment of Assignor's Interest May 13, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO., LTD.
Reel/Frame 032880/0089 →