Patent Assignment
Reel/Frame 021211/0107
Assignment of Assignor's Interest
Recorded: 2008-07-09
Pages: 3
Assignor
RYU, JAE-CHUL
Executed: 2008-05-14
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Multi-Layer Circuit Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.