Patent Assignment
Reel/Frame 022842/0668
Assignment of Assignor's Interest
Recorded: 2009-06-18
Pages: 3
Assignors
SHIM, CHANG-HAN
Executed: 2009-03-26
KANG, SUNG-IL
Executed: 2009-03-26
PARK, SE-CHUEL
Executed: 2009-03-26
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board with Multiple Metallic Layers and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.